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High temperature resistant 1000 degree mold heat insulation board vulcanizing press insulation insulation board glass fiber board zero cutting processing 10mm custom made

price:USD$5.00
discount 70% in 2018-10-19 to 2018-10-21
price: USD$ 3.50
freight :USD$18.00,(Express)
freight :USD$7.00,(Postal parcel)
Minimum Order Quantity:3
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Epoxy plate -Electric board introduction, please look down

Buyers must read! Due to the different material specifications and thickness, this connection is priced casually! If you want to buy samples, you can directly take 10 yuan to mail, custom specifications (size), please contact customer service

Color of epoxy board:yellowblackAqua Green

Panel size: 1030*1230

                1030*2010

                 1230*2450

 

Properties of 3240 epoxy plate:

3240 epoxy laminate surface is smooth, no bubbles, no pits and wrinkles, but allow other defects that do not affect the use, such as: scratches, indentation, stains and a small amount of spots. The edge should be cut neatly, and the end face shall not be divided into layers and cracks.

Implementation standards:GB/T1303.1-1998。
Temperature tolerance grade:B
Color:True colorsyellow)、Aqua Greenetc.
Characteristic:After curing epoxy resin system has excellent mechanical properties, high temperature strength Jie machine, good electrical properties under high humidity.
Electrical property:The cured epoxy resin system is an excellent insulating material with high dielectric properties, resistance to surface leakage and arc resistance
Uses:It is suitable for mechanical, electrical, electronic, electrical and other fields. Also used in the processing of insulation parts, processing into all kinds of insulation parts and equipment insulation structure parts.
Thickness:Under normal circumstances, 0.3 ~ 50mm, also can be produced according to the requirements of 50~150mm thick plate.
The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring opening polymerization of oxygen in the resin molecule. No water or other volatile by-products are released. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2%) during curing.
 
 

Brief introduction of materials:

Epoxy resin is an organic macromolecule compound containing two or more epoxy groups in the molecule, except for some of them, the relative molecular weight of them is not high enough. (two). The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain, and the epoxy group can be located at the end, intermediate or ring like structure of the molecular chain. Because of the active epoxy groups in the molecular structure, they can be cross-linked with various types of curing agents to form insoluble, non melting polymers with three directional network structure.

Application characteristics:

1 Various forms:Various resins, curing agents and modifier systems can almost meet the requirements of various applications for the form, ranging from very low viscosity to high melting point solids.

2 Easy curing:The epoxy resin system can be used in almost all kinds of curing agents0180Curing at temperature range of temperature.

3 Strong adhesion:The existence of polar hydroxyl groups and ether bonds in the molecular chain of epoxy resin makes it highly adhesive to various materials. When epoxy resin is cured, the shrinkage is low and the internal stress is small, which also helps to improve the adhesion strength.

 

4 Low contractility:The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring opening polymerization of oxygen in the resin molecule. No water or other volatile by-products are released. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2%) during curing.

5 Mechanical properties:The cured epoxy resin system has excellent mechanical properties.

6 Electrical properties:The cured epoxy resin system is an excellent insulating material with high dielectric properties, resistance to surface leakage and arc resistance.

7 Chemical stability:Generally, the cured epoxy resin system has excellent alkali resistance, acid resistance and solvent resistance. Like other properties of the cured epoxy system, the chemical stability depends on the selected resins and curing agents. Proper selection of epoxy resin and curing agent can make it have special chemical stability.

8 Dimensional stability:The synthesis of many properties above makes the epoxy resin system outstanding in dimensional stability and durability.

 

9Mold resistance:The cured epoxy system is resistant to most molds and can be used in harsh tropical conditions.

Electric board

Cold stamping plate: Color: orange red.

Specification: 2-40mm*1000mm*1200mm

 

Material Science

Synthesis: phenolic laminate made from bleached wood paddle impregnated with phenolic resin grease.

purpose

Bakelite bakelite plate: with insulation, do not produce static, wear-resistant and heat-resistant properties, as an electronic product, mechanical switch and variable resistor for tooling and production line fixture, and can be used in transformer oil and other products.

Bakelite, is a kind of synthetic chemical substances, when heated after molding, then solidification can not plastic caused by other things, because it is non absorbent, conductive, high temperature resistance, high strength characteristics, with wide application for electrical products, hence the name.

Electronic production tool fixture production, performance testing......

Characteristic

Room temperature electrical performance, good machining performance, the proportion of 1.45, warping degree is less than or equal to 3 per thousand, with electrical, mechanical and processing properties of excellent. Paper electric board is the most common laminate, is also the world's most widely used, the largest amount of industrial laminate.

application

It is suitable for motor, electrical equipment and insulation structure parts with high mechanical performance requirements. Mechanical strength is good, mainly used in ICT, ITE fixture insulation parts processing, testing fixture, silicone rubber key mold, fixture board, mold splint, table grinding pad, packaging machine, comb and so on.

Physical property table

Electric board of project unit

Color red / Black

Specific gravity g/cm1.45

Temperature (continuous) degree C140

Temperature (short) degree C300

Water absorption rate%<1.5

Linear thermal expansion coefficient Kx10

Flammability (UL94) 94HB

The vertical layer to the flexural strength of MPa = 120

The vertical layer to the compressive strength of MPa is greater than or equal to 250

The tensile strength of MPa = 100

Impact strength kJ/m67

Adhesion strength N3600

Insulation resistance 1.0*10 after immersion

Vertical layer electrical strength KV/m12.1

Parallel layer breakdown voltage KV10

The relative dielectric constant (1MHz/50Hz) 5.5/-

Volume resistance 10-7~10-8 ohm xcm

Surface resistance Omega

Economic performance

Bakelite products due to its low price of raw material and product characteristics is excellent, many plastic products preferred alternatives.

The price of raw materials products in the price of ABS bakelite almost 50%. Although the bakelite molding products for heating molding, processing time than ordinary plastic, mould wear on the larger steel demand is higher, but because of the raw material price advantage, is still the preferred alternative to many plastic parts.