The vertical layer to the flexural strength of A: normal: E-1/150150 = 340Mpa + 5 C
Impact strength parallel to layer (beam method): = 230KJ/m
Insulation resistance after immersion (D-24/23): 5 x 108.
The vertical layer to the electrical strength (90 + 2 C in transformer oil, thickness 1mm): = 14.2MV/m
Parallel to the layer. The breakdown voltage (90 + 2 C in transformer oil): = 40KV
The relative dielectric constant (50Hz = 5.5).
The relative dielectric constant (1MHz = 5.5).
The dielectric loss factor (50Hz = 0.04).
The dielectric loss factor (1MHz = 0.04).
Absorbent (D-24/23, thickness 1.6mm): less than 19mg
(1) melting point of FR-4 process board (203 C)
(2) high resistance to chemicals
(3) low loss coefficient (Df0.0025)
(4) stable and low dielectric constant (Dk2.35)
(5) thermoplastic materials
FR-4 epoxy glass cloth substrate is a kind of substrate with epoxy resin as binder and electronic glass cloth as reinforcing material. Its bonding sheet and inner core thin copper clad laminate are important substrates for making multilayer printed circuit boards.
The mechanical properties, dimensional stability, impact resistance and moisture resistance of the epoxy glass cloth substrate are higher than that of the paper substrate. Its electrical performance is excellent, the working temperature is higher, and its performance is less affected by the environment. In the process, has great advantages than other resin woven glass plate. These products are mainly used for double-sided PCB, the amount is great.
Epoxy glass cloth substrate, the most widely used product model for FR-4, due to the installation of electronic products and the development of PCB technology, and the emergence of high Tg FR-4 products.