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Epoxy resin board, insulation board, heat insulation board, jig plate, die plate, glass fiber board cutting 5mm

You parents, factory direct sales, all sizes can be customized, cutting, engraving processing! The price of 10 yuan is not the price of the material itself 10 yuan, is to provide customers with long size * width * thick to quote, but usually after the auction to change prices! Because the goods can only be marked a price! Please note that no contact with customer service directly photographed purchase, will not be shipped.

discount 70% in 2018-10-22 to 2018-10-24
price: USD$ 7.00
freight :USD$18.00,(Express)
freight :USD$7.00,(Postal parcel)
Minimum Order Quantity:2
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Epoxy board
Brief introduction of materials

Epoxy resin is an organic macromolecule compound containing two or more epoxy groups in the molecule, except for some of them, the relative molecular weight of them is not high enough. (two). The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain, and the epoxy group can be located at the end, intermediate or ring like structure of the molecular chain. Because of the active epoxy groups in the molecular structure, they can be cross-linked with various types of curing agents to form insoluble, non melting polymers with three directional network structure.

Application characteristics

1, diverse forms. Various resins, curing agents and modifier systems can almost meet the requirements of various applications for the form, ranging from very low viscosity to high melting point solids.

2, easy curing. The epoxy resin system can be cured almost in the temperature range of 0~180 degrees with various curing agents.

3, strong adhesion. The existence of polar hydroxyl groups and ether bonds in the molecular chain of epoxy resin makes it highly adhesive to various materials. When epoxy resin is cured, the shrinkage is low and the internal stress is small, which also helps to improve the adhesion strength.

4, low contractility. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring opening polymerization of oxygen in the resin molecule. No water or other volatile by-products are released. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2%) during curing.

Insulation board, epoxy board, 3240 epoxy board

Product Description: This product epoxy board: glass fiber cloth bonded by epoxy resin, heating and pressing production, model 3240, at high temperature mechanical performance, high humidity, electrical performance is stable. It is suitable for mechanical, electrical and electronic parts with high insulation structure. It has high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistant class F (155 degree).

Specification thickness: 0.5 ~ 100mm

Regular specification: 1000mm*2000mm

Color: yellow, water, green

Place of origin: domestic import

In the case of high temperature 180 degrees, heating deformation, generally not with other metals in a piece of heat, may cause sheet metal change