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Epoxy resin board, insulation board, heat insulation board, jig plate, die plate, glass fiber board cutting 3mm

You parents, factory direct sales, all sizes can be customized, cutting, engraving processing! The price of 10 yuan is not the price of the material itself 10 yuan, is to provide customers with long size * width * thick to quote, but usually after the auction to change prices! Because the goods can only be marked a price! Please note that no contact with customer service directly photographed purchase, will not be shipped.

discount 70% in 2018-10-18 to 2018-10-20
price: USD$ 7.00
freight :USD$18.00,(Express)
freight :USD$7.00,(Postal parcel)
Minimum Order Quantity:2
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Epoxy board
Brief introduction of materials

Epoxy resin is a polymer compound, a molecule containing two or more than two epoxy groups, in addition to individual, their relative molecular mass is not high. The molecular structure of epoxy resin in the molecular chain with lively epoxy group as its characteristic, the epoxy groups can be located in the end of the chain, or intermediate molecules into ring like structures. Because the molecular structure of epoxy containing active, so that they can be cured with various types of agent crosslinking reaction and the formation of insoluble and infusible polymers with three direction mesh structure.

Application characteristics

1, diverse forms. All kinds of resin, curing agent, modifier system almost can adapt to all kinds of application form of the request, which can range from extremely low viscosity to high melting point of solid.

2, easy curing. The epoxy resin system can be cured almost in the temperature range of 0~180 degrees with various curing agents.

3, strong adhesion. The existence of polar hydroxyl groups and ether bonds in the molecular chain of epoxy resin makes it highly adhesive to various materials. When epoxy resin is cured, the shrinkage is low and the internal stress is small, which also helps to improve the adhesion strength.

4, low contractility. The epoxy resin and the curing agent reacts by direct addition reaction or resin molecules of the epoxy group ring opening polymerization, no water or other volatile by-products release. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2%) during curing.

Insulation board, epoxy board, 3240 epoxy board

Product Description: the product of epoxy board: glass fiber cloth with epoxy resin glue and heating and pressurizing production, for the 3240 model, the mechanical properties in high temperature and high humidity in stable electrical performance. It is suitable for mechanical, electrical and electronic parts with high insulation structure. It has high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistant class F (155 degree).

Specification thickness: 0.5 ~ 100mm

Regular specification: 1000mm*2000mm

Color: yellow, water, green

Place of origin: domestic import

In the case of high temperature 180 degrees, heating deformation, generally not with other metals in a piece of heat, may cause sheet metal change